**Stock levels and Prices for web orders only, please call for store stock**

Product Information:

Arctic MX-4 Thermal Paste

Arctic MX-4 Thermal Paste

  • £5.04 inc vat
  • £4.20 ex vat

  • 1 In Stock
  • Stock levels for web orders only, please call for store stock
  • Manufacturer #: MX-4




MX-4 - Arctic Cooling MX-4 Thermal Paste - ARCTIC MX-4 is a new thermal compound that guarantees exceptional heat dissipation from components and maintains the needed stability to push your computer system to its maximum. Similar to the performance of existing and acclaimed ARCTIC MX-series, ARCTIC MX-4 continues to be overclocker’s ultimate choice when choosing thermal compounds. Prior to its introduction into the market, ARCTIC MX-4 has already received a Top Product Award from PC Games Hardware in a Germany print magazine in August 2010 as it prevailed against 11 other thermal compounds in the market.

Description

Key Features
Easy Application
Optimal Thermal Conductivity
Low Thermal Resistance
Non-Electrical Conductive
Non-Capacitive
Non-Corrosive
No Curing
No Bleeding

Superior Performance and Easy Application

The ARCTIC MX-4 is a premium-grade thermal paste with exceptional performance and ease of application. It is an electrically non-conductive paste that is applied between CPU/GPU and designated coolers to transfer the dissipated heat from the components to the heat sink. Since the ARCTIC MX-4 is a metal-free compound, it eliminates the risks of causing short circuit and in turn adding more protection to your computer.

The new formula in the ARCTIC MX-4 features optimal thermal conductivity and low thermal resistance. These characteristics effectively dissipate the emitted heat from the core components.

The consistency of the ARCTIC MX-4 is designed for simple application. Its texture is just thin enough to spread onto components using fingers without creating much mess.

Great Bargain for its Value
With its competitive pricing, the performance of the ARCTIC MX-4 is the best thermal paste on the market by far.

Application
CPU, GPU and other applications between power semiconductor components and heat sinks.
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